Specification parameter

InterfaceNetwork3*lan(1Gbps) 2*wan  (1Gbps)
SIM2FF(Dual SIM)
4G moduleDual 4G module
Buttonreset
adapterInput voltage:12V-2A
SolutionRouting and WiFi chipset supplierMTK
BASERouting and WiFi chipset modelMT7621AT+MT7615DN
Routing and WiFi processor infoIEEE 80 2.11 a/b/g/n/ac
DDR/SPI256MBytes/16MBytes
RFMain antennaExternal antenna
Receive diversity antennaExternal antenna
WiFi band2400MHz-2483.5MHz  5170MHz-5835MHz
MIMO for WiFi2.4G 5dbi X 2    5G 5dbi X 2
Max. transmitter power for WiFi

802.11a   15dBm±2dBm;

802.11b   22dBm±2dBm;

802.11g   18dBm±2dBm;

802.11n   17dBm±2dBm; 

802.11ac 17dBm±2dBm;

SoftwareLanguageChinese&English
APN SettingSupported
Device SettingsSupported
WIFI SettingsSupported
Routing SettingsSupported
Firewall SettingsSupported
LEDSupported
Technical standardWiFi standard802.11 a/b/g/n/ac
WiFi securityWPA/WPA2
OSWindows XP,Windows Vista ,Windows 7/8/10,MAC,Linux
BrowserIE (7.0 and later), Firefox (3.0 and later), Safari (4.0 and later), Opera (10.0 and later), Chrome (10.0 and later)
EnvionmentOperating temperature0 to 50° C
Storage temperature-40 to 70° C
Humidity5% to 95% 


Module information

IDInterfaceLCC
SIZE29.0mm × 32.0mm × 2.4mm
SolutionWireless chipset supplierASR
BaseWireless chipset modelASR1803S
Wireless processor infoCAT4
USIM/SIM slot

Standard 6 PIN SIM card interface

3V SIM card and 1.8V SIM card

RFWCDMA bandB1/B8
LTE TDD bandB34/B38/B39/B40/B41
LTE FDD bandB1/B3/B5/B8
MIMO for wireless2 × 2 DL SU-MIMO for LTE and HSPA
Max. transmitter power for wireless

Class 3 (23dBm±2dB) for LTE FDD

Class 3 (23dBm±2dB) for LTE TDD

Class 3 (24dBm +1/-3dB) for UMTS                         

Technical standardWCDMA/LTE

DC-HSPA+   Max 42 (DL)/ Max 5.76 (UL)                               

WCDMA: UL 384Kbps   DL 384Kbps                                          

TD LTE : UL 35Mbps;DL 130Mbps

FDD LTE :UL 50Mbps;DL150Mbps

EnvionmentOperating temperature-20 to 60° C
Storage temperature-40 to 85° C
Humidity5% to 95%